Status
Completed
Material Class
E-Scrap
specific materials
Printed Circuit Boards (PCBs)
18-01-RM-13

Epoxy/Silicon Potting Material Removal for Greater Recovery of Circuit Boards

NODE
Technical Thrust
Remanufacturing & EOL Reuse
Low-Cost Component Repair Technologies & Restoration Methods
About

More cost-effective technologies are needed to remove coating or potting materials from circuit boards to enable repair and reuse. Two alternative technologies, laser ablation and micro-media blasting, will be tested and evaluated to quantify cost-effectiveness relative to industry specified cost targets.

project Members
Corecentric solutions logo
Caterpillar inc logo
Rochester institute of technology logo

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