Status
Completed
Material Class
E-Scrap
specific materials
Printed Circuit Boards (PCBs)
18-01-RM-13
Epoxy/Silicon Potting Material Removal for Greater Recovery of Circuit Boards
NODE
Technical Thrust
Remanufacturing & EOL Reuse
Low-Cost Component Repair Technologies & Restoration Methods
project Members
About
More cost-effective technologies are needed to remove coating or potting materials from circuit boards to enable repair and reuse. Two alternative technologies, laser ablation and micro-media blasting, will be tested and evaluated to quantify cost-effectiveness relative to industry specified cost targets.
PUBLICATIONS
Currently There Are No Publications For This Project