Status
In Progress
Material Class
E-Scrap
specific materials
Printed Circuit Boards (PCBs)
18-01-RM-14

Condition Assessment of Used Electronics

NODE
Technical Thrust
Remanufacturing & EOL Reuse
Remanufacturing Analysis Tools & Methods
About

Detecting solder joint and interconnection failures on used electronics presents a serious cost challenge for remanufacturers because detection is currently completed manually. Several automated methods for detection of these failures will be examined to determine their feasibility for use in the remanufacturing industry.

project Members
Corecentric solutions logo
Caterpillar inc logo
Rochester institute of technology logo

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